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TN1515-600B
15 A standard SCR
Table 1. Main features
Value 15 600 15 Unit A V mA
Symbol IT(RMS) VDRM/VRRM IGT (Q1)
A
G K
Description
Specifically designed to control motor in hand tools application, the TN15 SCR is available in DPAK package, providing a high robustness against stalled rotor operating conditions in a small SMD package Table 2. Order code
Marking TN15 15600 TN15 15600
A G A K DPAK TN1515
Part number TN1515-600B-TR TN1515-600B
Table 3.
Symbol IT(RMS) IT(AV) ITSM I t dI/dt IGM PG(AV) Tstg Tj VRGM
Absolute maximum ratings
Parameter RMS on-state current (180 conduction angle) Average on-state current (180 conduction angle) Non repetitive surge peak on-state current It Value for fusing Critical rate of rise of on-state current IG = 2 x IGT , tr 100 ns Peak gate current Average gate power dissipation Storage junction temperature range Operating junction temperature range Maximum peak reverse gate voltage tp = 8.3 ms tp = 10 ms tp = 10 ms F = 120 Hz tp = 20 s Tc = 109 C Tc = 109 C Tj = 25 C Tj = 25 C Tj = 125 C Tj = 125 C Tj = 125 C Value 15 9.5 165 A 150 113 50 4 1 - 40 to + 150 - 40 to + 125 5 As A/s A W C V Unit A A
July 2007
Rev 2
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Characteristics
TN1515-600B
1
Table 4.
Symbol IGT VGT VGD IH IL dV/dt VTM VTO RD IDRM IRRM
Characteristics
Electrical characteristics (Tj = 25 C, unless otherwise specified)
Test conditions Vout = 12 V, RL = 33 Vout = 12 V, RL = 33 Vout = VDRM, RL = 33 IT = 500 mA IG = 1.2 IGT VD = 67% VDRM, gate open ITM = 30 A, tp = 380 s Threshold voltage Dynamic resistance VDRM = VRRM Tj = 125 C Tj = 25 C Tj = 125 C Tj = 125 C Tj = 25 C Tj = 125 C Tj = 125 C MIN. Tj = 25 C MAX. MAX. MIN. MAX. MAX. MIN. MAX. MAX. MAX. MAX. 2 mA Values 2 mA 15 1.3 0.2 40 60 200 1.6 0.85 25 5 V V mA mA V/s V V m A Unit
Table 5.
Symbol Rth(j-c) Rth(j-a)
Thermal resistance
Parameter Junction to case (DC) Junction to ambient S = 0.5 cm2 Value 1.2 70 Unit C/W C/W
Figure 1.
P(W)
14
=180
Maximum power dissipation versus average on-state current
Figure 2.
IT(AV) (A)
16 14 12 10 8 6
Average and DC on-state current versus case temperature
12 10 8 6 4
360
D.C.
=180
4 2 0
2
I T(AV) (A)
0 0 1 2 3 4 5 6 7 8 9 10
TC (C)
0 25 50 75 100 125
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TN1515-600B
Characteristics
Figure 3.
Average and DC on-state current versus ambient temperature, PCB FR4, copper thickness 35 m
Figure 4.
Thermal impedance, junction to ambient, versus pulse duration, PCB FR4, copper thickness 35 m
IT(AV) (A)
2.5
SCU=0.5cm
Zth( j-a) (C/W)
100
SCU= 0.5 cm
2.0 1.5 1.0 0.5 0.0 0
=180
D.C.
10
T amb (C)
25 50 75 100 125
1 1.E-03
t P (s)
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Figure 5.
Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values)
Figure 6.
Surge peak on-state current versus number of cycles
IGT, IH, IL [T j] / IGT, IH, IL [T j=25C]
ITSM (A)
180 160
2.4 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0
Tj(C)
I H & IL IGT
140 120 100 80 60 40 20 0 1
Repetitive TC=109C
Non repetitive Tj initial=25C
tp=10ms
One cycle
Number of cycles
10 100 1000
-40 -30 -20 -10 0 10 20 30 40 50 60 70 80 90 100110120130
Figure 7.
Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t
Figure 8.
On-state characteristics (maximum values)
ITSM(A), It (As)
ITM (A)
100.0
Tj initial=25C
1.E+04
dI/dt limitation
10.0
Tj=125C
1.E+03
ITSM
Tj=25C
1.0
Tj max. : Vto = 0.85 V RD = 25 m
1.E+02 0.01
t P(ms)
0.10 1.00
It
VTM (V)
10.00
0.1 0.0 0.5 1.0 1.5 2.0 2.5 3.0
3.5
4.0
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Ordering information scheme
TN1515-600B
Figure 9.
Junction to ambient thermal resistance versus copper surface under tab, PCB FR4, copper thickness 35m
Rth(j-a) (C/W)
100
80
60
40
20
SCU (cm)
0 0 5 10 15 20 25 30 35 40
2
Ordering information scheme
Figure 10. Ordering information scheme
TN 15 15 - 600 SCR series RMS Current 15 = 15 A Sensitivity 15 = 15 mA Voltage 600 = 600 V Package B = DPAK Packing mode Blank = Tube -TR = Tape and reel B (-TR)
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TN1515-600B
Package information
3
Package information
Epoxy meets UL94, V0 DPAK dimensions
DIMENSIONS REF. Millimeters Min. A
E B2 L2 C2 A
Table 6.
Inches Min. 0.086 0.035 0.001 0.025 0.204 0.017 0.018 0.236 0.251 0.173 0.368 Max. 0.094 0.043 0.009 0.035 0.212 0.023 0.023 0.244 0.259 0.181 0.397
Max 2.40 1.10 0.23 0.90 5.40 0.60 0.60 6.20 6.60 4.60 10.10
2.20 0.90 0.03 0.64 5.20 0.45 0.48 6.00 6.40 4.40 9.35
A1 A2 B
D
B2 C C2
H L4 B G A1
R
R C
D E
A2 0.60 MIN.
G H
V2
L2 L4 V2
0.80 typ. 0.60 0 1.00 8
0.031 typ. 0.023 0 0.039 8
Figure 11. DPAK footprint (dimensions in mm)
6.7 3 3 1.6
2.3 6.7 2.3
1.6
In order to meet environmental requirements, ST offers these devices in ECOPACK(R) packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
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Ordering information
TN1515-600B
4
Ordering information
Table 7. Ordering information
Marking TN15 15600 TN15 15600 Package DPAK DPAK Weight 0.3 g 0.3 g Base qty 2500 75 Delivery mode Tape and reel Tube
Part number TN1515-600B-TR TN1515-600B
5
Revision history
Table 8.
Date 13-Mar-2006 11-Jul-2007
Revision history
Revision 1 2 Initial release. Added pin out labels to package illustration on cover page. Changes
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TN1515-600B
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